In IIT Ropar, the average placement package grew from 15.85 lakhs per year in 2019–20 to 20.24 lakhs per year in 2021–2022 and 20.99 lakhs per year in 2022–2023 (annualized).
In the last five years, there has been a growth in the number of enrolled and placed students at IIT Ropar. Between 2017–18 and 2022–23, the number of students enrolled increased significantly from 82 to 281, and over the same time frame, the number of students placed increased significantly from 74 to 231.
82 undergraduate students enrolled for placements in 2017–18, rising to 88 in 2018–19 and 113 in 2019–20, according to data made accessible by IIT Ropar. The number increased to 252 and then 281 in 2021–2022 and 2022–2023, respectively, nevertheless.
Similar to how the number of students placed climbed from 74 in 2017–18 and 2018–19 to 96 in 2019–20. The number of pupils placed still significantly increased despite the Covid epidemic, reaching 223 in 2021–2022 and 231 in the most recent placement season (2022–2023).
However, the placement rate has experienced both highs and lows. The placement rate was 90.24 percent in 2017–18, fell to 84.09 in 2018–19, climbed to 84.96 and 88.49 in 2019–20 and 2021–22, respectively, before falling back to 82.21 in the 2022–23 placement season.
Surprisingly, the average placement package has increased despite the Covid epidemic, rising from Rs 15.85 lakh per year in 2019–20 to Rs 20.24 lakh per year in 2021–2022 and Rs 20.99 lakh per year in 2022–23.
Regarding IIT Ropar
The MHRD founded the Indian Institute of Technology (IIT) Ropar in Rupnagar in 2008.
Chemical engineering, civil engineering, computer science and engineering, electrical engineering, mechanical engineering, and metallurgical and materials engineering are the current BTech programs offered by the institute. Eight semesters make up the length of this program. The institute also provides MTech programs in a number of fields, including electrical engineering, mechanical engineering, computer science and engineering, and biomedical engineering.
